- Our Capabilities
- Software
- MedeA®
- InfoMaticA
- Specialty Builders
- Analysis and Properties
- Electronics
- Mechanical/Thermal Properties
- Phonon - Thermodynamic Properties
- Transition State Search
- P3C Polymer Property Prediction using Correlations
- LAMMPS-Diffusion
- LAMMPS-Thermal conductivity
- LAMMPS-Viscosity
- Embedded Atom Potentials
- Forcefields
- ForcefieldOptimizer
- LAMMPS-CED
- MedeA Surface Tension
- MedeA-HT
- MedeA-Morphology
- Compute Engines
- JobServer
TaskServer - Climbing Length Scales
- Services
- Library
Toughening of a bonded interface
GM Research & Development Center, 63 (2006)
The present work extends previous work on modeling the effect of a sinusoidal interface pattern on interfacial toughening between identical materials by incorporating both elastic-perfectly plastic and elastic-power-law-hardening models. The materials are assumed to be bonded by an infinitesimally-thin adhesive layer along a sinusoidal interface with prescribed amplitude to wavelength ratio (i.e. aspect ratio). The goal of the work is to explore how the macroscopic interfacial toughness (or condition for crack growth without an increase in the applied load) can be controlled by the interface geometry, the plasticity of the materials, and the cohesive properties of the interface.
Search
Full Text and Download
You can download (most) of the presentations and publications.