Thermal Transport in Nanostructured Electronic Materials

2016

Arthur France-Lanord, Volker Eyert, Alexander Mavromaras, Roman Tarnovsky, Erich Wimmer, Clive Freeman, and Paul Saxe

The relentless shrinking of microelectronic devices
makes thermal management an increasingly important topic. To
this end, we have developed a computational approach, which
allows the prediction of heat flux in nanostructures based on
atomistic simulations. As prototypical system, we present results
for a silicon – silicon dioxide nanostructure, with (a) abrupt
interfaces, and (b) interfaces after thermal annealing. A graphene
sheet on amorphous SiO2 has been chosen as the second example
to investigate the influence of a substrate on the extremely high
thermal conductivity of this two-dimensional material.

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