February 21, 2014
Meet us in session 12 Multi-Physics and Thermal Issues in Microelectronics on Tuesday April 08 2014
We'll illustrate the ease of use and state-of-the-art science behind MedeA in two application areas:
Thermal conductivity of amorphous-crystalline Si superlattices and Si-Ge alloys.
Mechanical and thermal properties of epoxy resin based thermosets, including adhesion to alumina and water and oxygen diffusion.
In case you can't attend, details of the talk are in the attached paper.
New Software Release: MedeA 3.0 -- Getting to Science Faster
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Atomistic Simulations Prove Instrumental for Oil & Gas Industry: TOTAL S.A. Presents Joint Work at the Workshop on "Characterization and Modeling...
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An Isopotential Surface (with Defects) for a LiH Molecule - Happy Halloween!
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Computational Materials Science
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