Meet us at EuroSimE

February 21, 2014

Atomistic Simulations for Designing and Testing Materials for Micro/Nano Electronics Systems

 

Meet us in session 12 Multi-Physics and Thermal Issues in Microelectronics on Tuesday April 08 2014

 

We'll illustrate the ease of use and state-of-the-art science behind MedeA in two application areas:

  • Thermal conductivity of amorphous-crystalline Si superlattices and Si-Ge alloys.

  • Mechanical and thermal properties of epoxy resin based thermosets, including adhesion to alumina and water and oxygen diffusion.

In case you can't attend, details of the talk are in the attached paper.

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